What Is Thermal Tape?

Quick Facts

• Product form: Double-sided thermally conductive adhesive tape, 0.20 mm thickness
• Carrier / backing: Thermally conductive acrylic film or fiberglass-reinforced polymer matrix
• Adhesive system: Thermally conductive pressure-sensitive acrylic (both sides)
• Thermal conductivity: ≥ 1.0 W/m·K (standard); up to 3.0 W/m·K (high-conductivity grade)
• Dielectric strength: ≥ 3,000 V (electrically insulating grade, per ASTM D1000)
• Operating temperature: –40°C to +150°C continuous
• Core industrial uses: LED strip & module bonding, PCB power component mounting, IGBT / MOSFET heatsink attachment, battery pack thermal management, motor driver modules
• Standard thickness: 0.20 mm; custom 0.10–1.00 mm available

Technical Specifications & Material Science

Construction: How 0.20 mm Thermal Tape Transfers Heat

A 0.20 mm thermal tape cross-section comprises three functional layers: two thermally conductive pressure-sensitive adhesive layers (typically 70–90 µm each) bonded to a central thermally conductive carrier film (20–60 µm). The adhesive layers contain aluminum oxide (Al₂O₃), boron nitride (BN), or aluminum nitride (AlN) filler particles dispersed in an acrylic or silicone matrix. Filler particle size and loading percentage (typically 60–80 wt%) directly govern thermal conductivity—higher loading increases conductivity but reduces conformability and adhesion to rough surfaces.

The bondline thickness control achieved by tape (±0.02 mm at 0.20 mm nominal) is its primary advantage over thermal grease in production environments. Thermal grease bondline thickness varies with application pressure, operator technique, and pump-out over time, leading to thermal resistance variation across a production batch of ±30% or more. Tape eliminates this variability.

Electrical isolation is a critical secondary function. Most thermal tape constructions provide dielectric strength ≥3,000 V, electrically isolating the component from the heatsink chassis—essential where the heatsink is chassis ground and the component drain/collector pad is at switching voltage potential. Verify the specific grade's dielectric rating against the application's working voltage plus appropriate safety margins per IEC 60664-1 creepage and clearance requirements.

Standard Technical Parameters — JTT-Tape Thermal Conductive Tape (0.20 mm)

Industrial Applications

1. LED Module & Strip Bonding to Heatsinks

High-power LED COB arrays and rigid LED strips generate junction temperatures that must be managed within Tj ≤ 85–105°C to maintain lumen output and rated lifespan (L70 at 50,000 hours). Thermal tape at 0.20 mm provides a controlled, repeatable bondline between the LED MCPCB and the extruded aluminum heatsink, without the squeeze-out contamination risk of thermal grease on LED optics or PCB traces. In automated LED assembly lines, tape-die-cut pads can be dispensed and applied robotically at throughputs exceeding 1,000 units/hour—a process impossible with paste-form thermal interface materials.

2. Power Semiconductor Heatsink Attachment (IGBT / MOSFET / Diode)

IGBT modules in variable frequency drives and inverters dissipate 50–500 W continuously. Mounting to aluminum or copper heatsinks via thermal tape eliminates the torque-variation problem inherent in spring-clip or screw-mount configurations, where uneven clamping force creates high-resistance air pockets. Tape also provides electrical isolation between the device baseplate (switching potential) and chassis-grounded heatsink, with dielectric strength ≥3,000 V meeting the isolation requirements of IEC 61800-5-1 for motor drive equipment up to 600 V working voltage.

3. PCB Component Thermal Management

Voltage regulators, DC-DC converter ICs, and linear regulators on dense PCB assemblies frequently exceed their junction temperature ratings when relying solely on PCB copper pour for heat spreading. Attaching a small aluminum or copper heatsink via 0.20 mm thermal tape reduces thermal resistance by 30–60% compared to double-sided foam tape (λ ≈ 0.04 W/m·K) used as an adhesive substitute. The tape's thin profile (0.20 mm vs. 1.00–3.00 mm for foam tape) also preserves PCB-to-component clearances in compact enclosures.

4. Battery Pack & Energy Storage Thermal Management

Lithium-ion cell packs in EV battery modules and stationary storage systems require inter-cell thermal management to prevent thermal runaway propagation. Thermal tape applied between cells and cooling plates or between cell groups and aluminum separator frames provides both thermal coupling (conducting heat to the cooling circuit) and electrical isolation between cells at different state-of-charge voltages. The tape's compressibility accommodates cell swelling of 1–3% during charge-discharge cycles without debonding.

5. Motor Driver & Inverter Module Assembly

Three-phase motor driver modules in industrial automation, robotics, and HVAC systems combine multiple power devices (IGBTs, gate drivers, current sensors) on a single substrate. Bonding this substrate to a cold plate or finned heatsink via thermal tape standardizes the assembly process across production shifts and eliminates torque spec non-conformances on fastened assemblies. At 0.20 mm, thermal resistance contribution from the tape itself is ≤0.20 cm²·K/W—acceptable for most motor drive power density levels below 200 W/cm².

Thermal Tape vs Thermal Pad vs Thermal Grease: How to Choose

Three thermal interface material (TIM) categories dominate industrial thermal management. Selection depends on power density, bondline control requirements, reworkability, and production process constraints.

Selection rule: Where bondline precision, automated assembly, permanent adhesive bond, and electrical isolation are simultaneously required—LED manufacturing, battery pack assembly, PCB heatsink attachment—0.20 mm thermal tape is the optimum TIM format. Where maximum thermal conductivity (>5 W/m·K) is the overriding requirement and mechanical fasteners provide clamping force, thermal grease or high-conductivity phase-change pads should be evaluated. For field-service reworkable assemblies, non-adhesive thermal pads with mechanical retention are preferred.

Customization & Supply Capabilities

JTT-Tape thermal conductive tape is manufactured by JIAOTAOTAO New Materials Co., Ltd. (Dongguan, Guangdong), established 2009. Production capacity: 8 automated coating lines, 6,000 m² facility. Certifications: ISO 9001:2015, SGS, UL94 V-0. The following custom supply capabilities are available direct from the manufacturer:

• Thickness Options: 0.10 mm / 0.15 mm / 0.20 mm / 0.25 mm / 0.30 mm / 0.50 mm / 1.00 mm. Non-standard thicknesses on request.
• Custom Width Slitting: 5 mm to 1,000 mm, tolerance ±0.5 mm. Slit from jumbo master rolls for volume orders.
• Die-Cut Pads: Custom pad shapes, frames, and arrays for automated pick-and-place or manual assembly. Tolerance ±0.2 mm. Kiss-cut on liner for peel-and-stick application.
• Thermal Conductivity Grades: Standard (≥1.0 W/m·K), High-Conductivity (≥2.0 W/m·K), Ultra (≥3.0 W/m·K). Specify based on power density and heatsink thermal resistance.
• Liner Options: Single-liner (one-side release), double-liner (sequential peel), polyester liner (for flatness in die-cut pads).
• OEM / Private Label: Custom reel labeling, carton marking, and co-branding for distributor programs.
• Free Qualification Samples: Up to 3 configurations dispatched within 5 business days. Specify substrate type (aluminum / copper / FR4) and power dissipation for grade recommendation.
• MOQ: 1 carton for standard slit rolls. Die-cut tooling: one-time setup fee, then no additional MOQ premium.
• Lead Time: Standard thickness / standard widths: 7–15 business days. Custom die-cut or non-standard thickness: 15–25 business days.

FAQ for Engineers & Procurement

Request a Data Sheet, Free Sample, or Factory Quote

JTT-Tape 0.20 mm thermal conductive tape—≥1.0 W/m·K thermal conductivity, ≥3,000 V dielectric strength, –40°C to +150°C operating range, UL94 V-0—provides precision bondline control for LED assembly, power semiconductor mounting, PCB thermal management, battery pack integration, and motor drive manufacturing. Available in standard slit widths, custom die-cut pad formats, and multiple conductivity grades, direct from the Dongguan source factory.